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TSMC to Quadruple Capacity by 2023

Taiwan Semiconductor Manufacturing Company (TSMC) has announced plans to quadruple its capacity by 2023. The company's expectations for this increase are significant, highlighting the growing demand for semiconductor products across various industries. TSMC also spoke about its new Arizona plant, which has broken ground and is making progress. Although the new fab is not expected to come online until 2024, it will add an additional 20,000 wafers per month of capacity, further solidifying TSMC's position as a leading semiconductor manufacturer.

N5 Node Performance Improvements

TSMC highlighted its N5 node, which has already produced better yields than any of its previous nodes. The company attributes this success to the production learning curve and defect density improvements made with N6 and N7. TSMC notes that these advancements are critical in meeting the growing demand for semiconductors. The company's use of Extreme Ultraviolet (EUV) lithography on more layers is also a significant factor in its improved yields.

EUV Lithography Dominance

TSMC accounts for approximately 65% of cumulative EUV wafers shipped and represents a staggering 50% of the install base for EUV machines. This dominance highlights TSMC's leadership in the adoption of EUV lithography, a technology critical for the manufacturing of modern semiconductors.

N4 Node Introduction

TSMC introduced its N4 node, which is an optical shrink of its N5 node. The company notes that N4 is an enhanced N5 technology offering a six percent smaller die area, as well as iterative power and performance improvements. Production for N4 is scheduled for quarter three of 2021.

N3 Node Volume Production

TSMC also mentioned its plans for N3 volume production, which are set to take place in the back half of 2022. This marks an important milestone in TSMC's expansion plans.

New Process Nodes: N6RF and N5A

TSMC announced two new process nodes: N6RF and N5A. The N6RF node is optimized for 5G and Wi-Fi 6 or 6e silicon, while the N5A option is aimed at automotive silicon. These new nodes demonstrate TSMC's commitment to meeting the diverse needs of various industries.

AMD Keynote and Graphics Partnership with Samsung

AMD showcased its Andreno GPU in laptops from companies like Asus and Dell. The company also confirmed its partnership with Samsung, which has been developing custom Radeon IP for its next flagship SoCs. At Computex 2021, AMD's Lisa Sue delivered a brief update on the partnership, mentioning that the custom graphics IP is based on RDNA 2 and will include features such as variable rate shading and ray tracing capabilities.

Ray Tracing in Mobile Devices

AMD highlighted its efforts to bring ray tracing to mobile devices. The company notes that this technology will be integrated into Samsung's next flagship SoCs, marking a significant milestone for the adoption of real-time ray tracing in consumer electronics.

Background Information on AMD and Samsung Partnership

The partnership between AMD and Samsung has been in development since 2019. Although there have been few updates over the years, AMD confirmed that it is working with Samsung to accelerate graphics innovation in the mobile market. The custom graphics IP will be based on RDNA 2 and will include features such as variable rate shading and ray tracing capabilities.