**MSI's Latest Case Release: The XY Series**
The MSI XY series is one of the latest case releases from the company, and it's been met with mixed reactions from enthusiasts and reviewers alike. The case features a unique design, including a glass sheet on the front left side of the panel, which is set to be replaced by a mesh version in the near future. According to sources, the mesh panel would provide improved airflow and potentially better thermal performance.
The current design of the XY series has been criticized for its lack of efficiency, particularly when it comes to thermals and air intake at the front of the case. The glass and aluminum construction creates a barrier that hinders airflow, resulting in reduced cooling performance. However, MSI is working on addressing this issue by incorporating more fans into the design.
One notable feature of the XY series is its side panel removal system, which has been praised for its simplicity and practicality. The panels can be removed using six pins, creating a secure closure that prevents dust and debris from entering the case. This feature is one of the few positives in an otherwise mediocre case design.
MSI's attempt to improve their case design has been hampered by their lack of experience with the industry. As a company new to case manufacturing, they need time to develop their skills and learn from their mistakes. While the XY series shows promise, it's clear that MSI is still working on finding its footing in this area.
**Competitive Landscape: A Comparison of Case Manufacturers**
The computer hardware industry is dominated by two main categories: case manufacturers and motherboard makers. Motherboard manufacturers have historically struggled to produce high-quality cases, with some notable exceptions like ASUS. The company has made significant strides in recent years, improving their case designs and listening to feedback from enthusiasts.
In contrast, motherboard manufacturers often prioritize product design over case design, which can result in inferior products. MSI falls into this category, despite their best efforts. Their attempts to improve their cases have been slow to come to fruition due to the limitations of using external suppliers rather than owning their own factory.
**The Role of Suppliers in Case Design**
MSI's reliance on external suppliers is a major obstacle in their quest for improved case design. Without direct control over the manufacturing process, MSI must rely on its suppliers to implement changes and improvements. This can lead to delays and limitations in customization options.
In contrast, companies like Coolermaster and Lea Me have the advantage of owning their own factories, allowing them to make rapid changes and roll out new designs without relying on external suppliers. MSI would benefit from having more control over their case design, but for now, they must rely on their suppliers to meet their expectations.
**Upcoming Products and Future Developments**
MSI is expected to release additional products in the near future, including a new case that incorporates the mesh panel design. The company has shown promise in this area, but it's unclear how well the final product will perform. Additionally, MSI plans to embark on factory tours, which could provide valuable insights into their manufacturing process and give enthusiasts a better understanding of their designs.
**Conclusion**
The MSI XY series is just one example of the company's ongoing efforts to improve their case design. While they show promise in certain areas, there are still significant challenges to overcome before they can deliver high-quality products that meet enthusiast expectations. With continued investment in research and development, MSI may yet become a leader in the case manufacturing industry.
"WEBVTTKind: captionsLanguage: eneveryone we're closing out our trip in Taipei for our factory tourists we have a lot of factory footage live already and we have more coming to the the channel including a couple of tours of a power supply facility if it's not all ready online by the time this video goes up but now we have an update on MSI we visited a Massiah to check out some of their upcoming motherboards and one of them was the x5 70 tomahawk and that board specifically is supposed to be a response to vrm thermal concerns so we're gonna report on the updates to the x5 70 tomahawk and also talked about some of the cases that MSI is working on just briefly before they come to market later this year before that this video is brought to you by Squarespace Squarespace is what we've been using for years to manage our own gamers Nexus store and we've been incredibly happy with the choice Squarespace makes ecommerce easy for those interested in starting stores but it also has powerful tools to build all types of websites photo galleries for photographers resume and portfolio sites and small business sites are all easily done through Squarespace having built a lot of client websites the old way before running GN full-time we can easily recommend Squarespace as a powerful fast solution go to squarespace.com slash gamers Nexus to get 10% off your first purchase with Squarespace so first for the motherboard is 2 X 570 tomahawk this board it was shown at CES and not too much has changed but now it's been positioned more strategically as a response to concerns of MSI's VRMs running among the hottest of the x5 so kneeboard msre says that the memory is mostly unchanged it's still daisy-chained but they have a couple of updates between PCB versions 1.1 and 1.3 namely that the PCB version 1.3 which will either full retail version that you all will be able to buy later will have improved spacing between the circuits which should improve memory performance and memory overclocking performance especially it should get it closer to the rest of the AMA size x5 Sony lineup from what the company has told us the heatsink is large but we had a couple of criticisms of it it's uncertain at this point whether any of our criticisms will make it into the final product I should note that the x5 Sony tomahawk was originally planned for mass production this month so March but that all got pushed back due to human malware so MSI we actually I'll talk about this ribbit - Emma size Factory in Shenzhen we visited before it was shut down for about two months because of first Lunar New Year and then the extended shutdown 4cv concerns and they're just now getting back online but the issue the postponement of the exercise 7e tomahawk is for more reasons than just Emma size factory being shut down is that the supply factories were affected so the heatsink manufacturers then you can also have some ripple effect through SMD manufacturers and even if the SMD makers the surface mount device makers are still operating they buy all their materials from someone so metal suppliers raw material suppliers and those factories might be affected as well so the end result is that mass production moves from this month to probably April maybe May but they're pushing for the expo so many tomahawk to come out as soon as they can get it out ideally before a rise in 4000 series start parts start shipping but it is delayed definitely until at least April at this point so anyway the heatsink the upside of the delay is that it's possible there could be some changes implemented but overall it's fairly finalized the heat sink we think needs some holes in it to breathe right now it looks like a very large heatsink it's just it's a narrow stack on top of the MOSFETs and then just a bridge over towards the i/o and it the whole point of it is to cover the i/o and make it look uniform and pretty as a motherboard manufacturers are often attempting to do these days the downside the thing we're concerned about is that heat generation of the MOSFETs will sort of pool in that area between the i/o and the heatsink and I'll just create a hot pocket of air a hot pocket of air free advertisement for them there's no escape for the air out of the rear i/o though so we've recommended punching some holes in there somewhere either slats in the vrm heatsink or just holes in the back where the i/o shield is because right now it's kind of a heat trap it's still a big heatsink it's a lot of mass but there's not a ton of surface area and I messiah is looking at increasing the fin density and actually doing proper fins for the heatsinks for future motherboards that we can't talk about today so that's a good move it's one that gigabyte made it a couple of years ago but as far as the ex-wife so many tomahawk it's still mostly just a large piece of metal that's made first for visuals and and for function second that said the vrm should take care of a good amount of the dissipation or the spread of heat across the service area of the board we'd have to see in testing if it actually is a market improvement over the existing boards from MSI but what we know today is that it uses is l99 360s they are 60 amp our stages I'm going to send all this information over to build Zoid and he's going to make sure that it looks good he'll provide his opinion on it we'll run a video but there's 60 amp power stages it's 12 phase 2 phases for the SOC and the controller at 12 phase for the V 4 V core I should say controller isn't is l69 2 4 7 and the doubler is my SL 66 1 7 a the board is supposed to cost 200 to 210 dollars so the price point hasn't really changed since CES but MSI was a bit more hesitant and giving us that price it sounds like it might move around in the upwards direction a little bit as a result of some changes that they've made specifically because of concerns with VR and thermals on their motherboards so they're increasing the cost to improve the thermal performance because obviously you need to spend more money to improve the components other info on the board so the well then the heatsink kind of being lacking in our opinion the other things to know CPU fan and pump fan are up near the RAM the bottom row down at the south end of the motherboard has four fan slots all next to each other air fan headers and the there's to RGB headers near the RAM there's an easy debug LED pretty standard stuff and all the board's including this one that MSI's making are moving towards type C support for front panels and the future additional information the 90 degree connectors that have started to become pop popular with gigabyte and EVGA msi is looking into those but has no further comment at this point so you might see a 90 degree 24 pins at some point in the future from them the thermal performance we haven't tested the board we don't have it but MSI has run internal tests and we did ask about their methodology and it sounds reasonable but we haven't run the test ourselves so you know grain of salt currently it looks like homicide is expecting the x5 so many tomahawks to be around were the X 570 unified performs in terms of vrm thermal performance MSI measures this with a FLIR thermal camera we criticize those a lot but there are times when they make sense and a lot of that depends on how much money you spend on one so assuming they're using a good FLIR imager it should be within a couple degrees of a thermocouple thermocouples going to give you more data resolution under the heatsink whereas the FLIR cameras are more useful for removing the heatsink and getting a baseline measure of how does the vrm do without a heatsink and then F once you put the heatsink on you obviously can't see the fats anymore and measuring the metal doesn't help so you'd have to take PCB measurements and you're live erm but anyway they say it should be a bit right around where they unify is if you're curious about that additional information the cases are kind of disappointing at present but have Headroom so MSI has actually implemented some of our feedback we feel like the the bulk of the major items we've provided feedback on its kind of been left out of the cases but they are improving in some areas so the secure 100-hour and the gun near 110 are the new case is the both models made more of a gap between the front of the chassis and the front of the front panel so that the fans mounted at the front of the case can pull air in more successfully at that 90 degree angle where it enters the case they haven't really ventilated the front at all the gun near 110 R is the case that's got a big glass sheet on the front left side of the panel and apparently they're gonna have a mesh version of that where the the glass on the front left would be removed and then mash would be used instead so that's a potential area for a case that's not completely horrible for thermals we'd have to test it we're supposed to have units potentially coming on the way both have type C support the pricing is 110 for the secure 100 R and 80 to 90 dollars the gun there I had a lot of criticisms of the cases and we talked about this at CES but we sort of break it into two pieces where four cases they're sort of the case manufacturers who generally know what they're doing most of the time and then there's the motherboard makers and there are two different camps the motherboard makers can't seem to really get it right so far Asus has done the second worst job at making computer cases that don't suck and gigabyte has done the first worst job at making cases that don't suck MSI is not really they haven't really made the push that asus has so far into cases they've also been the most open to listening to criticism and they've tried the hardest and implementing it but there's the problem where they don't own the factory so I'm like it company like Coolermaster or Lea me where we've seen their factories and they can deploy changes and roll them out immediately MSI has to rely on whatever its supplier can sell it and that often means very limited customization options so there's a lot of places still where we're hoping to see MSI improve in its case design department but right now it's still pretty weak and the biggest problem is thermals and air intake at the front of the case we talked to them a lot about it it's mostly glass and aluminum right now there's some upsides MSI has got a decent handle on quality in terms of the panel quality the chassis haven't really played with it but the front panels feel good it's just there they're not the right design for us other items of note the removal of the side panels is similar to Lian Lee's currently it's all prototype it's not out yet and if they go forward with that and do the the top removal to secure the two side panels within six pins holding it in that would actually be a really good feature so the side panel security is one of the best things they've done but it's that's that's the primary feature that we liked on it so the thin MSI is trying to do right now is overcome some of the thermal limitations created by the panel's by using more fans that's been shown to work NZXT has been fairly successful with it with like the h7 10 where NZXT has overcome an inefficient design by throwing a lot more brute force in there the downside is you start creating more noise and it is inefficient so at some level you start trading off where is it really cheaper to do this front panel design and throw more fans in there there's it make more sense to cut out half the fans and just make a front panel that actually breathes it's possible to meet halfway Lee Ann Lee has done it with their own where they've still got glass and glass and then intake on the side so it's kind of hidden but MSI is not quite there yet so anyway it looks like Emma sighs got a we genuinely think Emma sighs people during the cases have the right intentions which is to improve the product it's just that the company is new to this and they don't have a lot of experience with cases yet so it's gonna take them a while to get there and we're trying to push them in the right direction but the changes I've been really slow to come to fruition and some of that's because it's based on a supplier and they don't own the factory that makes the cases so anyway the two cases weren't really things that impressed us too much but we do want to see how the gun near performs with the mesh panel that might actually be not completely terrible because you'd have at least half of the front would be open so we'll see it might do okay and testing especially with that many fans it could do well compared to a lot of the other cases that are less efficient still the pricing is about right is just the rest of the features we need to see improvement on anyway that's gonna be it for MSI the XY so many tomahawks aboard we want to look at we should have one on the way after we get back and check back for our factory tours you can subscribe for more or click the link in the description below for additional factory tour footage from our trip here in Taiwan and or go to patreon.com/scishow sexist helps out directly or store documents it's not net we'll see you all next timeeveryone we're closing out our trip in Taipei for our factory tourists we have a lot of factory footage live already and we have more coming to the the channel including a couple of tours of a power supply facility if it's not all ready online by the time this video goes up but now we have an update on MSI we visited a Massiah to check out some of their upcoming motherboards and one of them was the x5 70 tomahawk and that board specifically is supposed to be a response to vrm thermal concerns so we're gonna report on the updates to the x5 70 tomahawk and also talked about some of the cases that MSI is working on just briefly before they come to market later this year before that this video is brought to you by Squarespace Squarespace is what we've been using for years to manage our own gamers Nexus store and we've been incredibly happy with the choice Squarespace makes ecommerce easy for those interested in starting stores but it also has powerful tools to build all types of websites photo galleries for photographers resume and portfolio sites and small business sites are all easily done through Squarespace having built a lot of client websites the old way before running GN full-time we can easily recommend Squarespace as a powerful fast solution go to squarespace.com slash gamers Nexus to get 10% off your first purchase with Squarespace so first for the motherboard is 2 X 570 tomahawk this board it was shown at CES and not too much has changed but now it's been positioned more strategically as a response to concerns of MSI's VRMs running among the hottest of the x5 so kneeboard msre says that the memory is mostly unchanged it's still daisy-chained but they have a couple of updates between PCB versions 1.1 and 1.3 namely that the PCB version 1.3 which will either full retail version that you all will be able to buy later will have improved spacing between the circuits which should improve memory performance and memory overclocking performance especially it should get it closer to the rest of the AMA size x5 Sony lineup from what the company has told us the heatsink is large but we had a couple of criticisms of it it's uncertain at this point whether any of our criticisms will make it into the final product I should note that the x5 Sony tomahawk was originally planned for mass production this month so March but that all got pushed back due to human malware so MSI we actually I'll talk about this ribbit - Emma size Factory in Shenzhen we visited before it was shut down for about two months because of first Lunar New Year and then the extended shutdown 4cv concerns and they're just now getting back online but the issue the postponement of the exercise 7e tomahawk is for more reasons than just Emma size factory being shut down is that the supply factories were affected so the heatsink manufacturers then you can also have some ripple effect through SMD manufacturers and even if the SMD makers the surface mount device makers are still operating they buy all their materials from someone so metal suppliers raw material suppliers and those factories might be affected as well so the end result is that mass production moves from this month to probably April maybe May but they're pushing for the expo so many tomahawk to come out as soon as they can get it out ideally before a rise in 4000 series start parts start shipping but it is delayed definitely until at least April at this point so anyway the heatsink the upside of the delay is that it's possible there could be some changes implemented but overall it's fairly finalized the heat sink we think needs some holes in it to breathe right now it looks like a very large heatsink it's just it's a narrow stack on top of the MOSFETs and then just a bridge over towards the i/o and it the whole point of it is to cover the i/o and make it look uniform and pretty as a motherboard manufacturers are often attempting to do these days the downside the thing we're concerned about is that heat generation of the MOSFETs will sort of pool in that area between the i/o and the heatsink and I'll just create a hot pocket of air a hot pocket of air free advertisement for them there's no escape for the air out of the rear i/o though so we've recommended punching some holes in there somewhere either slats in the vrm heatsink or just holes in the back where the i/o shield is because right now it's kind of a heat trap it's still a big heatsink it's a lot of mass but there's not a ton of surface area and I messiah is looking at increasing the fin density and actually doing proper fins for the heatsinks for future motherboards that we can't talk about today so that's a good move it's one that gigabyte made it a couple of years ago but as far as the ex-wife so many tomahawk it's still mostly just a large piece of metal that's made first for visuals and and for function second that said the vrm should take care of a good amount of the dissipation or the spread of heat across the service area of the board we'd have to see in testing if it actually is a market improvement over the existing boards from MSI but what we know today is that it uses is l99 360s they are 60 amp our stages I'm going to send all this information over to build Zoid and he's going to make sure that it looks good he'll provide his opinion on it we'll run a video but there's 60 amp power stages it's 12 phase 2 phases for the SOC and the controller at 12 phase for the V 4 V core I should say controller isn't is l69 2 4 7 and the doubler is my SL 66 1 7 a the board is supposed to cost 200 to 210 dollars so the price point hasn't really changed since CES but MSI was a bit more hesitant and giving us that price it sounds like it might move around in the upwards direction a little bit as a result of some changes that they've made specifically because of concerns with VR and thermals on their motherboards so they're increasing the cost to improve the thermal performance because obviously you need to spend more money to improve the components other info on the board so the well then the heatsink kind of being lacking in our opinion the other things to know CPU fan and pump fan are up near the RAM the bottom row down at the south end of the motherboard has four fan slots all next to each other air fan headers and the there's to RGB headers near the RAM there's an easy debug LED pretty standard stuff and all the board's including this one that MSI's making are moving towards type C support for front panels and the future additional information the 90 degree connectors that have started to become pop popular with gigabyte and EVGA msi is looking into those but has no further comment at this point so you might see a 90 degree 24 pins at some point in the future from them the thermal performance we haven't tested the board we don't have it but MSI has run internal tests and we did ask about their methodology and it sounds reasonable but we haven't run the test ourselves so you know grain of salt currently it looks like homicide is expecting the x5 so many tomahawks to be around were the X 570 unified performs in terms of vrm thermal performance MSI measures this with a FLIR thermal camera we criticize those a lot but there are times when they make sense and a lot of that depends on how much money you spend on one so assuming they're using a good FLIR imager it should be within a couple degrees of a thermocouple thermocouples going to give you more data resolution under the heatsink whereas the FLIR cameras are more useful for removing the heatsink and getting a baseline measure of how does the vrm do without a heatsink and then F once you put the heatsink on you obviously can't see the fats anymore and measuring the metal doesn't help so you'd have to take PCB measurements and you're live erm but anyway they say it should be a bit right around where they unify is if you're curious about that additional information the cases are kind of disappointing at present but have Headroom so MSI has actually implemented some of our feedback we feel like the the bulk of the major items we've provided feedback on its kind of been left out of the cases but they are improving in some areas so the secure 100-hour and the gun near 110 are the new case is the both models made more of a gap between the front of the chassis and the front of the front panel so that the fans mounted at the front of the case can pull air in more successfully at that 90 degree angle where it enters the case they haven't really ventilated the front at all the gun near 110 R is the case that's got a big glass sheet on the front left side of the panel and apparently they're gonna have a mesh version of that where the the glass on the front left would be removed and then mash would be used instead so that's a potential area for a case that's not completely horrible for thermals we'd have to test it we're supposed to have units potentially coming on the way both have type C support the pricing is 110 for the secure 100 R and 80 to 90 dollars the gun there I had a lot of criticisms of the cases and we talked about this at CES but we sort of break it into two pieces where four cases they're sort of the case manufacturers who generally know what they're doing most of the time and then there's the motherboard makers and there are two different camps the motherboard makers can't seem to really get it right so far Asus has done the second worst job at making computer cases that don't suck and gigabyte has done the first worst job at making cases that don't suck MSI is not really they haven't really made the push that asus has so far into cases they've also been the most open to listening to criticism and they've tried the hardest and implementing it but there's the problem where they don't own the factory so I'm like it company like Coolermaster or Lea me where we've seen their factories and they can deploy changes and roll them out immediately MSI has to rely on whatever its supplier can sell it and that often means very limited customization options so there's a lot of places still where we're hoping to see MSI improve in its case design department but right now it's still pretty weak and the biggest problem is thermals and air intake at the front of the case we talked to them a lot about it it's mostly glass and aluminum right now there's some upsides MSI has got a decent handle on quality in terms of the panel quality the chassis haven't really played with it but the front panels feel good it's just there they're not the right design for us other items of note the removal of the side panels is similar to Lian Lee's currently it's all prototype it's not out yet and if they go forward with that and do the the top removal to secure the two side panels within six pins holding it in that would actually be a really good feature so the side panel security is one of the best things they've done but it's that's that's the primary feature that we liked on it so the thin MSI is trying to do right now is overcome some of the thermal limitations created by the panel's by using more fans that's been shown to work NZXT has been fairly successful with it with like the h7 10 where NZXT has overcome an inefficient design by throwing a lot more brute force in there the downside is you start creating more noise and it is inefficient so at some level you start trading off where is it really cheaper to do this front panel design and throw more fans in there there's it make more sense to cut out half the fans and just make a front panel that actually breathes it's possible to meet halfway Lee Ann Lee has done it with their own where they've still got glass and glass and then intake on the side so it's kind of hidden but MSI is not quite there yet so anyway it looks like Emma sighs got a we genuinely think Emma sighs people during the cases have the right intentions which is to improve the product it's just that the company is new to this and they don't have a lot of experience with cases yet so it's gonna take them a while to get there and we're trying to push them in the right direction but the changes I've been really slow to come to fruition and some of that's because it's based on a supplier and they don't own the factory that makes the cases so anyway the two cases weren't really things that impressed us too much but we do want to see how the gun near performs with the mesh panel that might actually be not completely terrible because you'd have at least half of the front would be open so we'll see it might do okay and testing especially with that many fans it could do well compared to a lot of the other cases that are less efficient still the pricing is about right is just the rest of the features we need to see improvement on anyway that's gonna be it for MSI the XY so many tomahawks aboard we want to look at we should have one on the way after we get back and check back for our factory tours you can subscribe for more or click the link in the description below for additional factory tour footage from our trip here in Taiwan and or go to patreon.com/scishow sexist helps out directly or store documents it's not net we'll see you all next time\n"