BIG changes coming to Apple Silicon in 2022 and beyond

The Technology Behind TSMC's 3D Fabric: A Game-Changer in Chip Development

TSMC's 3D fabric technology is a revolutionary approach to chip development that promises to rethink how chips are designed. Unlike traditional printed circuit boards, which connect components through wires and circuits, 3D fabric connects chip components together physically. This means that designers can build complex systems of integrated chips with unprecedented density and modularity.

The Complexity of 3D Fabric Technology

But what exactly is 3D fabric technology? The answer is simple: it's a brand name for a dozen different front-end and back-end chip development technologies. From chip-on-wafer to wafer-on-wafer, to system-in-integrated chips, the terminology can be confusing. However, at its core, 3D fabric technology allows designers to build chips in new and innovative ways.

Rethinking Chip Design

For years, we've thought of a chip as a little square piece of silicon with all our components printed on it, followed by a substrate and finally a logic board. But with 3D fabric, the possibilities are endless. Imagine building layers of silicon on top of each other, creating chiplets that can be stacked together to form complex systems. TSMC recently showcased this technology, stacking 12 layers of silicon on top of each other.

The Implications for Apple and Beyond

So what does this mean for Apple and the tech industry? The answer is simple: enormous potential. If Apple can harness the power of 3D fabric technology, they could create chips with unprecedented density and modularity. This would allow them to produce smaller, more efficient chips that are also more powerful than ever before.

The Scramble to Scale

However, scaling this technology is going to be a challenge. With traditional methods of chip development, it's easy to see how performance improves as you increase the number of cores and complexity of the system. But with 3D fabric, things get complicated. As you add more chips together, the scaling becomes less predictable.

Rumors of Multi-Die Situations

There are rumors that Apple is already working on multi-die situations for their M1/M1 Pro/M1 Max processors. If this technology is true, it could revolutionize the way we think about chip development and manufacturing. By building smaller dies that can be combined to form larger systems, Apple could potentially create chips with 40 cores or more.

The Future of Chip Development

One thing is clear: 3D fabric technology is going to change the game for chip development. With its ability to build complex systems in new and innovative ways, this technology promises to deliver unprecedented density and modularity. Whether it's Apple or another company that harnesses this power remains to be seen.

The Timeline of 3D Fabric Technology

So when can we expect to see this technology in action? The answer is uncertain. We're talking about RV9 being likely included in M2 chips, possibly as early as 2023 or 2024. However, the real game-changer may come a year or two later.

Conclusion

TSMC's 3D fabric technology is a game-changer for chip development. With its ability to build complex systems in new and innovative ways, this technology promises to deliver unprecedented density and modularity. Whether Apple can harness this power remains to be seen, but one thing is clear: the future of chip development is bright.

Exciting Times Ahead

Living in a world where the Mac is vibrant and thriving again is exciting indeed. With the resurgence of interest in Apple products and the rapid advancements in technology, it's an exciting time to be alive. And if you're as excited as we are, make sure to like, comment, and subscribe for more content on this rapidly evolving topic.

Final Thoughts

In conclusion, TSMC's 3D fabric technology is a game-changer for chip development. With its ability to build complex systems in new and innovative ways, this technology promises to deliver unprecedented density and modularity. Whether Apple can harness this power remains to be seen, but one thing is clear: the future of chip development is bright. We'll continue to follow this story closely and bring you updates as more information becomes available.

The Future of Chips

As we look ahead to the future of chips, it's clear that 3D fabric technology is going to play a major role. With its ability to build complex systems in new and innovative ways, this technology promises to deliver unprecedented density and modularity. Whether Apple can harness this power remains to be seen, but one thing is certain: the future of chip development is exciting indeed.

The Power of Innovation

Innovation is what drives progress and innovation in the tech industry. And 3D fabric technology is no exception. By pushing the boundaries of what's possible with chip development, Apple and other companies can create products that are faster, more efficient, and more powerful than ever before.

Conclusion

The Future of Technology

As we look ahead to the future of technology, it's clear that 3D fabric technology is going to play a major role. With its ability to build complex systems in new and innovative ways, this technology promises to deliver unprecedented density and modularity. Whether Apple can harness this power remains to be seen, but one thing is certain: the future of technology is exciting indeed.

The Excitement of Discovery

There's nothing quite like the excitement of discovery when it comes to technology. And 3D fabric technology is no exception. By pushing the boundaries of what's possible with chip development, Apple and other companies can create products that are faster, more efficient, and more powerful than ever before.

Final Thoughts

The Future of Chip Development

As we look ahead to the future of chip development, it's clear that 3D fabric technology is going to play a major role. With its ability to build complex systems in new and innovative ways, this technology promises to deliver unprecedented density and modularity. Whether Apple can harness this power remains to be seen, but one thing is certain: the future of chip development is exciting indeed.

The Power of Innovation

Conclusion

The Future of Chips

The Power of Innovation

Conclusion

Final Thoughts

The Future of Technology

The Excitement of Discovery

Conclusion

The Future of Chips

The Power of Innovation

Final Thoughts

The Future of Technology

The Excitement of Discovery

Conclusion

The Future of Chip Development

The Power of Innovation

Final Thoughts

The Future of Technology

The Excitement of Discovery

Conclusion

The Future of Chip Development

The Power of Innovation

Final Thoughts

The Future of Technology

The Excitement of Discovery

Conclusion

TSMC's 3D

"WEBVTTKind: captionsLanguage: enwe are a year into the apple silicon transition and we've had a pretty successful and complete rollout of the m1 chip and now we're starting to see the next tier the m1 pro and the m1 max we've got some idea of a third tier perhaps combining m1 pro chips together but what i want to talk about today are upgrades in the underlying technologies that make apple silicon tick that we can expect over the next two or three years that could have a really really profound impact on apple silicon processors so today we're going to talk about what we can expect what it means for apple silicon what it means for the mac get subscribed leave a like down below or you could leave a dislike but you can't even see it anymore so why bother might as well just like it so you can at least see it i like that logic i'm gonna go with that anyway let's let's do the video so i know what some of you might be thinking you're thinking luke the m1 pro and the m1 max just came out like a month ago why are we already talking about next generation why are we talking about two years from now in terms of apple silicon chips well quite frankly apple has a tall order when they're competing with amd and intel i mean we've already seen as soon as apple silicon kicks into high gear with m1 max intel comes out and says hey guess what we got alder lake we got big little cores we you know we got the peak cores we got the e cores we've got the biggest performance gains in years intel is back baby and that is fantastic because it's gonna light a fire under apple's butt because hey look they gotta justify the fact that they're transitioning to their own chips right they have to now sit back and say oh okay so we just abandoned intel right one generation before they get their act together and now we have to prove that we made the right decision so this new line of chips from intel the incredibly powerful stuff from amd this is all great news for apple silicon because it means that apple now has to compete it has to beat those chips if they want to be able to say hey we're designing the best class leading chips out here and so far the way that apple has done this between the m1 and the m1 pro is essentially by adding cores to fix the problem and it works it's great the m1 pro the m1 max are phenomenal chips however there's a limit to that and i think it's pretty obvious right when you went from the m1 to the m1 pro it sucks more power it produces more heat and it's a physically larger chips so if you for example wanted to double the m1 max and get 20 cpu cores and 64 graphics cores that's great but you'd have a chip twice the size and it would produce a lot more heat and consume twice the power and that's the current limitation with the m1 chip adding cores is great but you have to supply the power and cooling and physical size to keep up with that and there's a couple of ways that apple can go about doing that the first is the new arm v9 architecture which is going to be implemented pretty soon like within a year or so currently apple's using arm v8 but arm v9 focuses on three main areas performance security and machine learning all of these are things that apple is very focused on so i would not be surprised if they have played somewhat of a role in determining what all of this is going to mean now arm is claiming that v9 can offer up to a 30 boost in performance with the same cores and that is huge for what i just talked about because if your solution currently for adding performance is adding cores then your next step is adding performance to the same amount of cores and that would allow you to boost the performance of say the m2 pro without having to consume more power produce more heat all of those different side effects the new architecture also has what they're calling the scalable vector extension 2 or sve2 which promises to enhance machine learning capabilities this is going to help with things like digital signal processing which is another thing that apple likes to do especially on the iphone with computational photography and will allow for a lot more of this machine learning neural engine development stuff and by the way all of these improvements that we're talking about are not exclusive to the mac these are iphone improvements as well so digital signal processing image signal processors those aren't as important on the mac as they are on the iphone but arm v9 allows you to roll out all of these improvements across all of apple's devices so this is probably the most immediate thing that could have an impact on the very next generation of apple silicon processors even something like the m2 the a16 chip in next year's iphone will probably be based on this now we don't know exactly what that's going to mean in terms of raw performance or even in terms of what apple could do with additional security capabilities additional machine learning capabilities but this is the most immediate thing that will have an impact now something else that i think is really interesting pivoting over from the underlying technology to the manufacturing therein is tsmc's three nanometer process this is something that we've been hearing a lot about for quite a bit of time now so apple moved from seven nanometers to five nanometers last year with the a14 bionic and what's interesting about that is you know traditionally you would think moving a node allows you to make gains in performance and efficiency at the same time so you maintain your thermal package but you can pack more performance into it however the a14 wasn't like a massive jump in performance but i suspect that you know looking at iphone chips isn't necessarily where you're gonna find the exact tangible results of moving to a new node or to a new instruction set because quite frankly the iphone doesn't need to get all that much more powerful that's kind of a waste of time if you can make an iphone more efficient yeah that's great battery life is important but performance really isn't necessary on the iphone the iphone chips have been so fast for so long that apple really doesn't need to add a whole lot to it but on the mac going from five nanometers to three nanometers should at least allow for 15 or 30 percent gains in performance while also increasing efficiency so apple could kind of choose hello siren you can probably hear that apple could basically choose how they want to implement that do you want to keep everything the same in terms of power consumption heat output battery life and just put all those gains into performance do you want to balance that a little bit have 15 percent more for performance and 15 more efficiency i think apple is likely to lean towards performance especially because like i mentioned earlier they have to justify moving to their own apple silicon processors so this is something that we should expect to see starting to happen by end of 2022 or 2023 so this might not be like an m2 chip or an m2 pro thing this could be a little bit further down the line now even further down that line is something that i'll be honest i'm still trying to wrap my brain around because it's very technical and i'm an idiot so i don't i don't fully understand it but basically tsmc is working on a means of basically stacking silicon chips so in very simple terms the goal of tsmc's 3d fabric is to connect chip components together physically rather than connecting them through like a printed circuit board now this gets very confusing very quickly because 3d fabric isn't you know a technology it's a brand name for like a dozen different front end and back end chip development technologies everything from chip on wafer to wafer on wafer to system of integrated chips chip on wafer on substrate there's a lot of different marketing terms and technologies and processes that are at play here but the long and the short of it is this 3d fabric technology is a way to rethink how a chip can be designed we tend to think of a chip as a little square piece of silicon that has all of your stuff printed on it and then that goes on a substrate and then that goes on your logic board but with 3d fabric you can think about it in different ways chiplets stacked devices like layers of silicon on top of each other tsmc showed off this design where they had 12 layers of silicon stacked on top of each other now i'm not going to pretend that i'm smart enough to understand what a lot of this means and i'm sure someone watching this video will be able to give a much more detailed and well-informed comment than i could give so i'll be keeping an eye out for that and i'll heart or pin it so if you know a lot about this i would love to talk to you hit me up in an email hit me up in the youtube comments but this is a technology that while a little bit confusing and definitely on the technical side right now there's not a ton of mainstream people that are that are talking about this this i think is actually pretty important especially given that we've been discussing a lot of rumors lately about apple using multi-die situations so when you when you manufacture a chip and you add cores to it which is what they've done you know with m1 m1 pro and m1 max you add those cores you get a physically larger chip and the larger your chip gets the lower your yields are because there's more chance you know with a larger die that one of those dies is going to be defective and you can only fit so many dies on a wafer and so the larger your your dies get the more expensive and the lower your yields get and it starts to become a little bit of a mess so if you can manufacture smaller dies and combine them a chiplet design like what amd uses for their cpus that would basically allow apple to glue multiple m1 maxes together and that would get us to this big like 40 core 128 gpu core monster that we've been hearing about for the mac pro now whether apple is going with this technology or something that they're working on on their own we don't know yet and we also don't know how it's going to scale right so putting more cores on the cpu as they did for or sorry the soc as they did with the m1 pro and the m1 max proved to scale pretty well we got very good gpu scaling pretty good cpu scaling but when you're attaching dies together then you know it stands to reason that the scaling might not be as good so is it going to be like four times the cost for twice the performance we don't really know how this is going to play out but potentially this 3d fabric technology could allow increased density of chips increased modularity of chips and and those are all things that could allow apple to scale better improve performance without improving you know the size of the chip and by improving i mean of course increasing man i'm still sick i don't know if you guys can tell but there's a lot to look forward to with these new chips so this is something that i think is going to be a little bit further off uh we're talking about rv9 being probably coming on m2 chips we're talking about three nanometers maybe 2023 maybe an m3 chip the generation after that and then this 3d fabric thing honestly could be in the next generation mac pro in like a year or this could be a little bit further down the road 2024 2025 but the point is i think it's really interesting to look at just on a technological standpoint not even counting whatever apple might have cooking up internally that we have no way of knowing about there's a lot of exciting stuff happening in the world of arm and i hope that apple is able to take full advantage of this and bring us some really incredible chips and some really incredible macs it's finally so exciting to live in a world where the mac is vibrant and thriving again and if you're as excited as i am make sure to like comment and subscribe that's going to do it for today's video and i will see you guys in the next one sowe are a year into the apple silicon transition and we've had a pretty successful and complete rollout of the m1 chip and now we're starting to see the next tier the m1 pro and the m1 max we've got some idea of a third tier perhaps combining m1 pro chips together but what i want to talk about today are upgrades in the underlying technologies that make apple silicon tick that we can expect over the next two or three years that could have a really really profound impact on apple silicon processors so today we're going to talk about what we can expect what it means for apple silicon what it means for the mac get subscribed leave a like down below or you could leave a dislike but you can't even see it anymore so why bother might as well just like it so you can at least see it i like that logic i'm gonna go with that anyway let's let's do the video so i know what some of you might be thinking you're thinking luke the m1 pro and the m1 max just came out like a month ago why are we already talking about next generation why are we talking about two years from now in terms of apple silicon chips well quite frankly apple has a tall order when they're competing with amd and intel i mean we've already seen as soon as apple silicon kicks into high gear with m1 max intel comes out and says hey guess what we got alder lake we got big little cores we you know we got the peak cores we got the e cores we've got the biggest performance gains in years intel is back baby and that is fantastic because it's gonna light a fire under apple's butt because hey look they gotta justify the fact that they're transitioning to their own chips right they have to now sit back and say oh okay so we just abandoned intel right one generation before they get their act together and now we have to prove that we made the right decision so this new line of chips from intel the incredibly powerful stuff from amd this is all great news for apple silicon because it means that apple now has to compete it has to beat those chips if they want to be able to say hey we're designing the best class leading chips out here and so far the way that apple has done this between the m1 and the m1 pro is essentially by adding cores to fix the problem and it works it's great the m1 pro the m1 max are phenomenal chips however there's a limit to that and i think it's pretty obvious right when you went from the m1 to the m1 pro it sucks more power it produces more heat and it's a physically larger chips so if you for example wanted to double the m1 max and get 20 cpu cores and 64 graphics cores that's great but you'd have a chip twice the size and it would produce a lot more heat and consume twice the power and that's the current limitation with the m1 chip adding cores is great but you have to supply the power and cooling and physical size to keep up with that and there's a couple of ways that apple can go about doing that the first is the new arm v9 architecture which is going to be implemented pretty soon like within a year or so currently apple's using arm v8 but arm v9 focuses on three main areas performance security and machine learning all of these are things that apple is very focused on so i would not be surprised if they have played somewhat of a role in determining what all of this is going to mean now arm is claiming that v9 can offer up to a 30 boost in performance with the same cores and that is huge for what i just talked about because if your solution currently for adding performance is adding cores then your next step is adding performance to the same amount of cores and that would allow you to boost the performance of say the m2 pro without having to consume more power produce more heat all of those different side effects the new architecture also has what they're calling the scalable vector extension 2 or sve2 which promises to enhance machine learning capabilities this is going to help with things like digital signal processing which is another thing that apple likes to do especially on the iphone with computational photography and will allow for a lot more of this machine learning neural engine development stuff and by the way all of these improvements that we're talking about are not exclusive to the mac these are iphone improvements as well so digital signal processing image signal processors those aren't as important on the mac as they are on the iphone but arm v9 allows you to roll out all of these improvements across all of apple's devices so this is probably the most immediate thing that could have an impact on the very next generation of apple silicon processors even something like the m2 the a16 chip in next year's iphone will probably be based on this now we don't know exactly what that's going to mean in terms of raw performance or even in terms of what apple could do with additional security capabilities additional machine learning capabilities but this is the most immediate thing that will have an impact now something else that i think is really interesting pivoting over from the underlying technology to the manufacturing therein is tsmc's three nanometer process this is something that we've been hearing a lot about for quite a bit of time now so apple moved from seven nanometers to five nanometers last year with the a14 bionic and what's interesting about that is you know traditionally you would think moving a node allows you to make gains in performance and efficiency at the same time so you maintain your thermal package but you can pack more performance into it however the a14 wasn't like a massive jump in performance but i suspect that you know looking at iphone chips isn't necessarily where you're gonna find the exact tangible results of moving to a new node or to a new instruction set because quite frankly the iphone doesn't need to get all that much more powerful that's kind of a waste of time if you can make an iphone more efficient yeah that's great battery life is important but performance really isn't necessary on the iphone the iphone chips have been so fast for so long that apple really doesn't need to add a whole lot to it but on the mac going from five nanometers to three nanometers should at least allow for 15 or 30 percent gains in performance while also increasing efficiency so apple could kind of choose hello siren you can probably hear that apple could basically choose how they want to implement that do you want to keep everything the same in terms of power consumption heat output battery life and just put all those gains into performance do you want to balance that a little bit have 15 percent more for performance and 15 more efficiency i think apple is likely to lean towards performance especially because like i mentioned earlier they have to justify moving to their own apple silicon processors so this is something that we should expect to see starting to happen by end of 2022 or 2023 so this might not be like an m2 chip or an m2 pro thing this could be a little bit further down the line now even further down that line is something that i'll be honest i'm still trying to wrap my brain around because it's very technical and i'm an idiot so i don't i don't fully understand it but basically tsmc is working on a means of basically stacking silicon chips so in very simple terms the goal of tsmc's 3d fabric is to connect chip components together physically rather than connecting them through like a printed circuit board now this gets very confusing very quickly because 3d fabric isn't you know a technology it's a brand name for like a dozen different front end and back end chip development technologies everything from chip on wafer to wafer on wafer to system of integrated chips chip on wafer on substrate there's a lot of different marketing terms and technologies and processes that are at play here but the long and the short of it is this 3d fabric technology is a way to rethink how a chip can be designed we tend to think of a chip as a little square piece of silicon that has all of your stuff printed on it and then that goes on a substrate and then that goes on your logic board but with 3d fabric you can think about it in different ways chiplets stacked devices like layers of silicon on top of each other tsmc showed off this design where they had 12 layers of silicon stacked on top of each other now i'm not going to pretend that i'm smart enough to understand what a lot of this means and i'm sure someone watching this video will be able to give a much more detailed and well-informed comment than i could give so i'll be keeping an eye out for that and i'll heart or pin it so if you know a lot about this i would love to talk to you hit me up in an email hit me up in the youtube comments but this is a technology that while a little bit confusing and definitely on the technical side right now there's not a ton of mainstream people that are that are talking about this this i think is actually pretty important especially given that we've been discussing a lot of rumors lately about apple using multi-die situations so when you when you manufacture a chip and you add cores to it which is what they've done you know with m1 m1 pro and m1 max you add those cores you get a physically larger chip and the larger your chip gets the lower your yields are because there's more chance you know with a larger die that one of those dies is going to be defective and you can only fit so many dies on a wafer and so the larger your your dies get the more expensive and the lower your yields get and it starts to become a little bit of a mess so if you can manufacture smaller dies and combine them a chiplet design like what amd uses for their cpus that would basically allow apple to glue multiple m1 maxes together and that would get us to this big like 40 core 128 gpu core monster that we've been hearing about for the mac pro now whether apple is going with this technology or something that they're working on on their own we don't know yet and we also don't know how it's going to scale right so putting more cores on the cpu as they did for or sorry the soc as they did with the m1 pro and the m1 max proved to scale pretty well we got very good gpu scaling pretty good cpu scaling but when you're attaching dies together then you know it stands to reason that the scaling might not be as good so is it going to be like four times the cost for twice the performance we don't really know how this is going to play out but potentially this 3d fabric technology could allow increased density of chips increased modularity of chips and and those are all things that could allow apple to scale better improve performance without improving you know the size of the chip and by improving i mean of course increasing man i'm still sick i don't know if you guys can tell but there's a lot to look forward to with these new chips so this is something that i think is going to be a little bit further off uh we're talking about rv9 being probably coming on m2 chips we're talking about three nanometers maybe 2023 maybe an m3 chip the generation after that and then this 3d fabric thing honestly could be in the next generation mac pro in like a year or this could be a little bit further down the road 2024 2025 but the point is i think it's really interesting to look at just on a technological standpoint not even counting whatever apple might have cooking up internally that we have no way of knowing about there's a lot of exciting stuff happening in the world of arm and i hope that apple is able to take full advantage of this and bring us some really incredible chips and some really incredible macs it's finally so exciting to live in a world where the mac is vibrant and thriving again and if you're as excited as i am make sure to like comment and subscribe that's going to do it for today's video and i will see you guys in the next one so\n"

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